New Investment Opportunities in US Advanced Packaging Stocks under the AI Computing Power Revolution
\nIn 2026, the global semiconductor industry is experiencing a structural transformation driven by AI. As a key link connecting chip design and system applications, advanced packaging technology has significantly enhanced its strategic position. With AI chip giants like NVIDIA and AMD continuously releasing computing power demands, and Southeast Asia accelerating the transfer of global semiconductor industries, the US advanced packaging sector is facing a historic opportunity for value reassessment. This article will deeply analyze the investment value and future path of the US advanced packaging sector from four dimensions: industry trends, regional policies, corporate layouts, and investment strategies.
\n\nI. Explosion of AI Computing Power Demand: Advanced Packaging Industry Entering Golden Growth Period
\nIn the first half of 2026, global AI computing power demand has shown explosive growth. Application scenarios such as data centers, autonomous driving, and edge computing continue to drive demand for high-performance chips. According to industry data, the computing power demand for AI training and inference chips is growing at an annual rate of over 40%, far exceeding the growth rate of about 10% in the traditional chip market. This trend has directly led to a surge in demand for advanced packaging technologies, especially advanced processes such as 2.5D/3D packaging, Through-Silicon Vias (TSV), and fan-out packaging.
\n\nThe core value of advanced packaging technology lies in its ability to effectively solve the balance between chip performance improvement and cost control under the background of slowing Moore's Law. Through packaging technology innovation, chip manufacturers can achieve higher integration and performance improvement without significantly reducing process nodes. This characteristic makes advanced packaging a key technical path for AI chip manufacturing, bringing continuous growth momentum for related companies.
\n\nFrom the perspective of US market performance, since 2026, the advanced packaging sector has achieved a gain of over 25%, far exceeding the overall performance of the semiconductor industry. Among them, packaging and testing leaders like ASE Technology Holding (ASE) and Amkor Technology have reached historic highs in stock prices, reflecting the market's strong optimism about the advanced packaging sector. This trend is expected to continue in the second half of the year. As AI chip manufacturers further release capacity demands, advanced packaging companies are expected to experience a growth situation of both volume and price increases.
\n\nII. Regional Industrial Transfer: Southeast Asia Becomes a New Growth Pole for Advanced Packaging
\nIn recent years, the global semiconductor industry has been accelerating its transfer from East Asia to Southeast Asia, a trend particularly evident in the advanced packaging field. Countries such as Malaysia, Vietnam, and Thailand are rapidly emerging as important bases for the global advanced packaging industry, leveraging cost advantages, policy support, and geographical location advantages. This regional industrial transfer has not only reshaped the global semiconductor supply chain but also brought new growth opportunities for US advanced packaging companies.
\n\nAs the world's third-largest semiconductor packaging and testing base, Malaysia has attracted large-scale investments from many packaging and testing giants including ASE and Amkor. In 2026, the Malaysian government launched the "Semiconductor Strategy 2.0" plan, aiming to attract over $10 billion in investment in the next five years, focusing on the development of advanced packaging technology. This policy dividend provides strong support for US packaging and testing companies with operations in Malaysia, expected to bring significant capacity expansion and cost advantages.
\n\nVietnam, leveraging the dual benefits of the Comprehensive and Progressive Agreement for Trans-Pacific Partnership (CPTPP) and the Regional Comprehensive Economic Partnership (RCEP), is accelerating the transfer of advanced packaging industries. In July 2026, the Vietnamese government introduced new policies for automotive chip packaging and testing, offering tax incentives and land support to attract foreign packaging and testing investment. Amkor Technology has announced a $2 billion investment to build an advanced packaging factory in Vietnam, expected to be operational in 2027, which will significantly enhance the company's capacity layout in the Southeast Asian region.
\n\nThailand is also not to be outdone, announcing in early 2026 the establishment of a 5 billion baht advanced packaging special fund to support the technology upgrading and capacity expansion of local packaging and testing companies. This move will attract more US packaging and testing companies to invest in Thailand, forming a regional industrial cluster effect. It is expected that by 2028, the Southeast Asian region will contribute over 25% of global advanced packaging capacity, becoming an important growth engine for US packaging and testing companies.
\n\nIII. Corporate Layout Dynamics: US Packaging and Testing Giants Accelerating Strategic Transformation
\nFacing the dual opportunities of surging AI computing power demand and regional industrial transfer, US packaging and testing leading enterprises are accelerating strategic layouts through capacity expansion, technology upgrading, and mergers and acquisitions to consolidate and enhance their market position. The strategic moves of these companies not only reflect industry development trends but also provide important reference for investors.
\n\nAs the world's largest packaging and testing company, ASE is accelerating the "Southeast Asia + US" dual-center strategy. In the first half of 2026, the company announced a $2 billion investment to build an advanced packaging factory in Malaysia, focusing on AI chip packaging capacity. At the same time, the company is also expanding its existing factory in Arizona, US, to meet the capacity needs of domestic AI chip manufacturers. This global layout enables ASE to fully benefit from the regional distribution characteristics of AI computing power demand, achieving optimal capacity allocation.
\n\nAmkor Technology has adopted a dual-wheel drive strategy of "technology leadership + regional expansion". The company recently reached a $1.5 billion cooperation agreement with NVIDIA to provide advanced packaging capacity support. Meanwhile, the company is also accelerating the layout of new capacity in Vietnam and Malaysia, with Southeast Asia expected to contribute over 35% of the company's revenue by 2027. Amkor's continuous investment in advanced packaging technology, especially its leading position in 2.5D/3D packaging technology, has given it a significant competitive advantage during the period of explosive AI computing power demand.
\n\nJiangsu Changjiang Electronics Technology (JCET) is enhancing its technical strength and market share through mergers and acquisitions. In 2026, the company announced the acquisition of a European semiconductor company specializing in advanced packaging, obtaining its patent technology and customer resources. This acquisition has significantly enhanced JCET's technical capabilities in automotive electronics and AI chip packaging, laying a solid foundation for entering the high-end market. The company's management stated that it will continue to increase R&D investment to maintain a technical leadership advantage in the advanced packaging field.
\n\nIV. Investment Strategy Analysis: Seizing the Value Reassessment Opportunity of US Advanced Packaging Sector
\nBased on the comprehensive analysis of industry trends, regional policies, and corporate layouts, we believe that the US advanced packaging sector is in a historic opportunity period for value reassessment. Investors can construct investment strategies from the following dimensions to seize the investment opportunities brought by this round of industrial upgrading.
\n\nFirst, focus on technology-leading enterprises. In the advanced packaging field, technical barriers are the core competitiveness. Investors should focus on companies that have core patents and leading technologies in advanced processes such as 2.5D/3D packaging and fan-out packaging, such as Amkor and ASE. These companies can fully benefit from the technical premium brought by the explosive AI computing power demand, achieving continuous growth in performance.
\n\nSecond, layout companies benefiting from Southeast Asian capacity expansion. With the acceleration of regional industrial transfer, companies with large-scale capacity in Southeast Asia will obtain significant cost advantages and policy dividends. Investors can focus on companies that have built or are building advanced packaging factories in countries such as Malaysia and Vietnam, such as Amkor and JCET. These companies are expected to achieve economies of scale through capacity expansion, enhancing profitability and market competitiveness.
\n\nThird, grasp the investment opportunities in the AI industry chain. As a key link in the AI industry chain, the development prospects of advanced packaging are closely related to the demand of AI chip manufacturers. Investors can focus on companies with deep cooperation with AI chip giants such as NVIDIA, AMD, and Google, such as ASE and Amkor. These companies can stably obtain AI chip packaging orders and enjoy the growth dividend brought by the explosive AI computing power demand.
\n\nFinally, focus on policy-benefiting companies. Support policies for the semiconductor industry from various governments will bring substantial benefits to related companies. Investors should focus on companies that benefit from policy support such as the US CHIPS and Science Act, Malaysia's "Semiconductor Strategy 2.0", and Vietnam's new policies for automotive chip packaging and testing. These policy dividends will bring financial support, tax incentives, and market opportunities to companies, enhancing long-term investment value.
\n\nV. Risk Warnings and Response Strategies
\nAlthough the US advanced packaging sector has broad prospects, investors still need to pay attention to related risk factors and formulate corresponding response strategies. First, the risk of technological iteration cannot be ignored. Semiconductor packaging technology is updated quickly, and companies that cannot maintain technological leadership may face the risk of market share decline. Investors should closely follow the R&D investment and technological innovation capabilities of companies, choosing high-quality companies with continuous innovation capabilities.
\n\nSecond, geopolitical risks may affect the stability of the global supply chain. Factors such as China-US trade friction and regional conflicts may lead to supply chain disruptions, affecting the normal production and operation of companies. Investors should pay attention to the supply chain diversification layout of companies, choosing those that have achieved global capacity allocation to reduce the impact of geopolitical risks.
\n\nThird, the risk of industry cycle fluctuations also needs to be alert to. The semiconductor industry has strong cyclical characteristics and may face demand decline and price pressure during economic downturns. Investors should pay attention to the order situation and capacity utilization of companies, choosing those with stable customer structure and long-term capacity planning to resist the impact of industry cycle fluctuations.
\n\nFinally, valuation risk cannot be ignored. With the continuous strengthening of the advanced packaging sector, the valuation of related companies has reached a historically high level. Investors should pay attention to the rationality of company valuations and avoid blindly chasing high prices. It is recommended to adopt a strategy of batch position building, buying in batches during market corrections to reduce investment costs and risks.
\n\nVI. Conclusion and Outlook
\nThrough comprehensive analysis, the US advanced packaging sector is facing historic development opportunities driven by the dual forces of explosive AI computing power demand and regional industrial transfer. With the continuous advancement of AI technology and the expansion of application scenarios, advanced packaging technology will become a key engine for the growth of the semiconductor industry. Meanwhile, Southeast Asia is rapidly emerging as a new growth pole for the global advanced packaging industry, leveraging cost advantages and policy support, providing broad development space for US packaging and testing companies.
\n\nFor investors, the US advanced packaging sector has important long-term investment value. It is recommended that investors focus on high-quality companies with technological leadership, reasonable regional layout, and deep integration with the AI industry chain, sharing the industry growth dividend through long-term holdings. At the same time, it is also necessary to pay attention to risk factors such as technological iteration, geopolitics, industry cycles, and valuation, formulate reasonable investment strategies, and achieve stable returns.
\n\nLooking to the future, with the continuous breakthrough of AI technology and the expansion of application scenarios, advanced packaging technology will usher in broader development space. It is expected that by 2028, the global advanced packaging market size will exceed $80 billion, with a compound annual growth rate of over 20%. In this context, the US advanced packaging sector is expected to maintain strong performance, bringing rich long-term returns to investors.
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