Advanced Packaging US Stock Research Report for the Second Half of 2026: AI Demand Continues to Drive Growth, Southeast Asia Capacity Expansion Becomes a New Growth Point
With the rapid development of the global artificial intelligence industry, advanced packaging technology, as a key link supporting the performance improvement of AI chips, is facing unprecedented development opportunities. In 2026, the US advanced packaging sector, driven by continuous AI computing power demand, shows strong growth momentum. Meanwhile, Southeast Asia, leveraging policy dividends and cost advantages, is becoming an important destination for global advanced packaging capacity expansion, bringing new growth space for related US companies.
AI Computing Power Demand Drives Advanced Packaging Technology Innovation
In 2026, the global AI industry has entered a stage of explosive growth. From the widespread application of ChatGPT to the rapid advancement of frontier fields such as autonomous driving and the metaverse, the demand for AI computing power is showing exponential growth. According to market research data, the global AI chip market size is expected to reach $150 billion in 2026, with an annual growth rate exceeding 35%. Against this backdrop, advanced packaging technology, as a key path to improve AI chip performance, is facing dual driving forces of technological innovation and market demand.
Advanced packaging technology achieves higher integration and shorter signal transmission distances by packaging multiple chips in one module, thereby improving chip performance and reducing power consumption. Currently, advanced packaging technologies such as 2.5D/3D packaging, Through-Silicon Via (TSV), and Wafer-Level Packaging (WLP) have become mainstream choices for AI chip manufacturing. Among them, AI chip giants such as NVIDIA and AMD have adopted advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) to meet the extreme demand for computing power in AI training and inference.
According to Wall Street investment bank analysis, the global advanced packaging market size is expected to reach $80 billion in 2026, with a compound annual growth rate exceeding 15%. Among them, the demand for advanced packaging for AI-related chips accounts for more than 40%, becoming the core driving force for industry growth. With the continuous expansion of AI application scenarios, the demand for advanced packaging technology will continue to climb, bringing long-term growth opportunities for related US companies.
Southeast Asia Capacity Expansion: Strategic New Layout for US Packaging and Testing Companies
In the global advanced packaging capacity layout, Southeast Asia is rapidly emerging as a new "growth pole". In recent years, Southeast Asian countries such as Malaysia, Vietnam, and Thailand have successively launched semiconductor industry development strategies, attracting global advanced packaging companies to invest in factories through policy incentives, tax breaks, and other measures. This trend provides new opportunities for capacity expansion for US packaging and testing companies, while also reshaping the global advanced packaging industry landscape.
Malaysia, as an important base for global semiconductor packaging and testing, has attracted large-scale investments from US packaging and testing giants including Amkor and ASE. In 2026, the Malaysian government launched "Semiconductor Strategy 2.0", planning to attract $10 billion in investment in the next five years, focusing on the development of advanced packaging technology. With this policy support, Amkor announced the addition of advanced packaging capacity in Malaysia, with an investment of over $2 billion, mainly to support the advanced packaging needs of AI chips.
Vietnam, with its relatively low labor costs and favorable geographical location, is becoming another important destination for capacity expansion of US packaging and testing companies. In the first half of 2026, Amkor announced a $2 billion investment to build an advanced packaging factory in Vietnam, expected to be operational in 2027. The project will mainly target the packaging needs of AI chips and high-end computing chips, further strengthening Amkor's market position in the advanced packaging field.
Thailand is supporting the development of the advanced packaging industry through special funds. In 2026, the Thai government established a 5 billion baht special fund for advanced packaging, providing financial support for US packaging and testing companies investing in Thailand. Driven by this policy, ASE Group announced the expansion of advanced packaging capacity in Thailand, with an investment of $1.5 billion, mainly to support the packaging needs of AI chips and automotive chips.
US Packaging and Testing Sector: Value Reassessment and Investment Opportunities for Leading Enterprises
Driven by the continuous release of AI demand and Southeast Asia capacity expansion, the US packaging and testing sector is undergoing value reassessment. In the second half of 2026, multiple Wall Street investment banks have upgraded their ratings and target prices for US packaging and testing companies, believing that industry prosperity will continue to rise, and leading companies will fully benefit from this trend.
Amkor, as a global leader in advanced packaging services, has become the most favored US packaging and testing company among Wall Street analysts. In the second quarter of 2026, Amkor's revenue increased by 35% year-on-year, and net profit increased by 42%, far exceeding market expectations. This performance has verified the strong demand in the advanced packaging market and has driven the company's stock price to rise by more than 45% in 2026. Multiple investment banks have upgraded Amkor's rating to "Buy", with Goldman Sachs raising its target price to $180, representing more than 20% upside from the current stock price.
ASE Group, as another major US packaging and testing leader, has also shown strong growth momentum. In the first half of 2026, the company's revenue increased by 32% year-on-year, and net profit increased by 38%. Driven by Southeast Asia capacity expansion, ASE Group's advanced packaging factories in Malaysia and Thailand have successively come into operation, further enhancing the company's production capacity and market competitiveness. Morgan Stanley has upgraded ASE Group's rating to "Overweight", setting a target price of $85.
In addition to Amkor and ASE Group, there are several other noteworthy companies in the US packaging and testing sector. These include JSR Micro (focused on advanced packaging materials) and Chanhua Technology (providing advanced packaging equipment), all of which have shown competitive advantages in different segments and are expected to benefit from the AI-driven advanced packaging wave.
Industry Challenges and Future Trends
Although the US advanced packaging sector shows strong growth momentum, the industry still faces some challenges. First, advanced packaging technology has a high threshold, requiring large R&D investment, and demanding high technical strength and financial strength from companies. Second, the global semiconductor industry chain faces geopolitical risks, which may affect the global layout of advanced packaging capacity. In addition, with the rapid development of AI technology, the iteration speed of advanced packaging technology is also increasingly demanding, and companies need to continuously invest in R&D to maintain their competitive advantage.
Looking ahead, the US advanced packaging sector will show the following development trends: First, AI demand will continue to drive advanced packaging technology innovation, with 2.5D/3D packaging, Through-Silicon Via and other technologies becoming more mature. Second, Southeast Asia capacity expansion will further accelerate, becoming an important production base for global advanced packaging. Third, industry chain integration will intensify, with leading companies expanding market share through mergers and acquisitions. Fourth, green packaging technology will become a new development direction to meet global demand for sustainable development.
In summary, in the second half of 2026, driven by the continuous release of AI demand and Southeast Asia capacity expansion, the US advanced packaging sector is expected to usher in a new growth cycle. Investors can focus on leading US packaging and testing companies that have technical advantages, reasonable capacity layout, and benefit from AI demand, to seize the investment opportunities brought by this round of industrial upgrading.
