Advanced Packaging US Stock Industry Analysis
More >US Invests $1.5B in Advanced Packaging, Igniting US OSAT Sector
The US Department of Commerce announced $1.5 billion to support domestic advanced packaging construction, instantly igni
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More >美银上调韩系存储双雄评级至“买入”:HBM4量产在即,AI存储超级周期开启
美银证券最新研报将三星电子与SK海力士评级从“中性”上调至“买入”,目标价大幅上调。报告指出HBM4量产进度超预期、AI服务器需求持续强劲,叠加DRAM价格上行周期,存储芯片成为亚洲半导体最具确定性的赛道。本文深度解读评级调整背后的产业逻辑
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More >越南推车规芯片封测新政,RCEP红利加速亚洲半导体供应链重构
2026年8月,越南政府发布车规芯片封测产业新政策,通过税收优惠和基建支持吸引外资,并借力RCEP关税减免扩大对日韩出口。此举将重塑亚洲半导体供应链,为美股车规芯片板块带来新变量。本文深度解读政策背景、产业机遇与投资影响。
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More >Vietnam Joins EU Carbon Border Mechanism, Reshaping Green Manufacturing in Southeast Asia
On July 28, 2026, Vietnam and EU signed a CBAM Memorandum of Understanding, marking a key step for SE Asia manufacturing
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More >越南推车规芯片封测新政,RCEP红利加速亚洲半导体供应链重构
2026年8月,越南政府发布车规芯片封测产业新政策,通过税收优惠和基建支持吸引外资,并借力RCEP关税减免扩大对日韩出口。此举将重塑亚洲半导体供应链,为美股车规芯片板块带来新变量。本文深度解读政策背景、产业机遇与投资影响。
美银上调韩系存储双雄评级至“买入”:HBM4量产在即,AI存储超级周期开启
美银证券最新研报将三星电子与SK海力士评级从“中性”上调至“买入”,目标价大幅上调。报告指出HBM4量产进度超预期、AI服务器需求持续强劲,叠加DRAM价格上行周期,存储芯片成为亚洲半导体最具确定性的赛道。本文深度解读评级调整背后的产业逻辑及对亚太封测链的传导
US Invests $1.5B in Advanced Packaging, Igniting US OSAT Sector
The US Department of Commerce announced $1.5 billion to support domestic advanced packaging construction, instantly igniting the U
马来西亚半导体战略2.0出炉:百亿投资撬动先进封装新格局
马来西亚政府正式推出国家半导体战略2.0,计划未来十年投入100亿林吉特(约23亿美元)深耕先进封装、芯片设计及自动化设备领域。此举标志着东南亚封测产业从传统组装向价值链高端升级,并将深刻影响全球半导体供应链布局及美股相关上市公司。
马来西亚50亿美元豪赌先进封装,美股封测板块迎来政策东风
2026年7月31日,马来西亚宣布投资50亿美元实施国家半导体战略2.0,聚焦先进封装技术研发与产能扩张,并在槟城打造全球领先封测产业园区。这一政策利好迅速传导至美股,安靠科技、日月光ADR等封测龙头股价应声上涨。本文深度解读该战略对全球先进封装产业格局的深远
Citi Upgrades SE Asia OSAT Sector Rating: AI Demand & Supply Chain Shift Create New Opportunities
Citi's latest report upgrades SE Asia OSAT sector from 'Neutral' to 'Overweight' with TP up 15%-20%. Surging AI packaging demand a
Amkor Q2 Earnings Beat, Advanced Packaging Boom Validates US OSAT Value Revaluation
On July 30, 2026, US OSAT leader Amkor Technology reported Q2 earnings, with revenue and net profit beating analyst expectations d
Goldman Sachs Raises Asian Semi Leaders' Targets: HBM & AI Fuel New Growth Cycle
Goldman Sachs' latest report raises US target prices for TSMC, Samsung, etc., citing AI & HBM demand driving H2 2026 earnings beat
Amkor Technology builds $2B Vietnam factory, accelerating advanced packaging in Southeast Asia
On July 29, 2026, Amkor Technology, a global advanced packaging leader, announced a $2 billion investment to build a FOWLP factory
Vietnam Joins EU Carbon Border Mechanism, Reshaping Green Manufacturing in Southeast Asia
On July 28, 2026, Vietnam and EU signed a CBAM Memorandum of Understanding, marking a key step for SE Asia manufacturing towards g







