ASE Global Semiconductor, a leader in semiconductor packaging, announced a $2 billion investment in Penang, Malaysia, to build an advanced packaging facility, focusing on 2.5D/3D packaging demands for AI chips and HPC. This move intensifies the advanced packaging capacity race in Asia-Pacific, with giants like TSMC and Samsung expanding production. Advanced packaging concept stocks in the US market have reacted positively, as investors watch for supply chain opportunities arising from capacity e